Intel, 3DGS to set up $3.3 billion substrate plant in Odisha

Odisha government has signed a Memorandum of Understanding (MoU) with Intel and 3D Glass Solutions (3DGS) to establish an Advanced Packaging Glass Core Substrate Manufacturing Facility in the state.

Union Minister of Electronics and IT Ashwini Vaishnaw along with Odisha Chief Minister Mohan Charan Majhi, Intel CEO Lip-Bu Tan, and other dignitaries witnessed the signing of the MoU to bring substrate manufacturing technology to India.

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“Congratulations to the Govt. of Odisha, Intel and 3DGS on signing an MoU to bring substrate manufacturing technology to India. This will further advance semiconductor ecosystem in India,” Vaishnaw wrote on X.

Congratulations to the Govt. of Odisha, Intel and 3DGS on signing an MoU to bring substrate manufacturing technology to India.

This will further advance semiconductor ecosystem in India. pic.twitter.com/elxs6r8muN

— Ashwini Vaishnaw (@AshwiniVaishnaw) May 29, 2026

Highlighting that the state was “entering a decisive new era of industrial and technological transformation,” the Chief Minister has termed it a “landmark step towards strengthening India’s semiconductor ecosystem and positioning Odisha as a hub for next-generation technology manufacturing.”

“This transformative investment will create high-skilled employment opportunities for our youth, attract ancillary industries and accelerate Odisha’s transition from traditional industries to advanced manufacturing, innovation and knowledge-driven growth,” he wrote on X.

Odisha is entering a decisive new era of industrial and technological transformation. Today, we signed an MoU with Intel Corporation and 3DGS Inc. for the establishment of an Advanced Packaging Glass Core Substrate Manufacturing Facility in the Bhubaneswar–Khurda region, a… pic.twitter.com/IgQPNdgtO6

— Mohan Charan Majhi (@MohanMOdisha) May 29, 2026

As per the official statement, the project has an estimated investment of approximately $3.3 billion, representing one of the largest high-tech manufacturing investments in the country.

The facility is proposed to be located in the Bhubaneswar–Khurda region. It is expected to leverage advanced glass-based substrate technologies and high-density interconnect packaging, essential for sectors such as artificial intelligence, high-performance computing, telecommunications as well as next-generation electronics.

On this project, Intel serves as a technology partner and will provide process expertise, technology licensing, quality systems, and workforce capability building, IANS reported.

The proposed project will be implemented in phases over a period of five to six years. Overall, it is aimed at generating more than 1,800 direct high-skilled employment opportunities, besides creating significant indirect employment across the broader manufacturing and technology ecosystem, the statement said.